Photonic Origami for On-chip 3D Micro-Optics
Seminar
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Speaker
Tal Carmon (Tel Aviv University)
Date
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2026-04-26 11:30:00
2026-04-26 11:30:00
Photonic Origami for On-chip 3D Micro-Optics
We fold micrometer-thick silica sheets into three-dimensional photonic devices on a silicon chip using a laser-induced local melting. Our structure contains parabolic micromirrors and microresonators with Q-factors exceeding 8 × 10⁶, which can be folded with milliradian resolution into knees and helices. This method extends silica photonics into the third dimension, providing a scalable, chip-compatible route to micro-optics for data processing, sensing, and precision tests of fundamental physics such as deviations from Newtonian gravity.
Resnick (#209), room 016
המחלקה לפיזיקה
physics.dept@mail.biu.ac.il
Asia/Jerusalem
public
Place
Resnick (#209), room 016
Abstract
We fold micrometer-thick silica sheets into three-dimensional photonic devices on a silicon chip using a laser-induced local melting. Our structure contains parabolic micromirrors and microresonators with Q-factors exceeding 8 × 10⁶, which can be folded with milliradian resolution into knees and helices. This method extends silica photonics into the third dimension, providing a scalable, chip-compatible route to micro-optics for data processing, sensing, and precision tests of fundamental physics such as deviations from Newtonian gravity.
Attached file
תאריך עדכון אחרון : 21/04/2026